H10P 72/7438
With parts of the auxiliary support remaining in the finished device
Official title: {with parts of the auxiliary support remaining in the finished device}
H10P72/7438 (With parts of the auxiliary support remaining in the finished device) appears on 682 US grants and 797 published applications in this corpus.
Search patents in H10P- Granted patents
- 682
- Published applications
- 797
- Assignees
- 235
- Inventors
- 1,309
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 11 | 13 |
| 2002 | 12 | 39 |
| 2003 | 23 | 28 |
| 2004 | 20 | 35 |
| 2005 | 19 | 25 |
| 2006 | 34 | 21 |
| 2007 | 19 | 31 |
| 2008 | 19 | 30 |
| 2009 | 15 | 38 |
| 2010 | 28 | 38 |
| 2011 | 38 | 47 |
| 2012 | 31 | 43 |
| 2013 | 46 | 41 |
| 2014 | 38 | 37 |
| 2015 | 45 | 50 |
| 2016 | 39 | 54 |
| 2017 | 29 | 24 |
| 2018 | 26 | 32 |
| 2019 | 29 | 26 |
| 2020 | 29 | 30 |
| 2021 | 22 | 25 |
| 2022 | 17 | 16 |
| 2023 | 18 | 20 |
| 2024 | 24 | 24 |
| 2025 | 11 | 21 |
| 2026 | 10 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microdevice substrate, display panel, preparation method, and display apparatus11 Aug 2026US 12,707,934 B2Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.
- Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device4 Aug 2026US 12,702,047 B2
- Method of manufacturing an electronic device and electronic device manufactured thereby28 Jul 2026US 12,696,789 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor element, method for manufacturing semiconductor element, semiconductor device, and method for manufacturing semiconductor device19 May 2026US 12,635,520 B2Novel Crystal Technology, Inc.
- Stacked semiconductor device including a cooling structure5 May 2026US 12,622,265 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Carrier structure and methods of forming the same20 Aug 2026US 2026/0248043 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacture method for manufacturing a wafer structure25 Jun 2026US 2026/0182428 A1Okmetic Ltd.
- Gate-all-around integrated circuit structures having doped subfin4 Jun 2026US 2026/0156884 A1Intel Corporation
- Electrolytic method for carrier wafer separation4 Jun 2026US 2026/0157147 A1Micron Technology, Inc.
- Die and package structure2 Apr 2026US 2026/0096447 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation413US 6,498,099 B1ASAT Ltd. · 2002