Die and package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
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Abstract
A die includes a substrate, a conductive pad, a connector a protection layer, and a passivation layer. The conductive pad is disposed over the substrate. The connector is disposed on the conductive pad. The connector comprises a seed layer and a conductive post on the seed layer. The protection layer laterally covers the connector. The passivation layer is disposed between the protection layer and the conductive pad. The conductive post is separated from the passivation layer and the protection layer by the seed layer.
Claims20
A die, comprising:
- a substrate;
- a connector over the substrate, wherein the connector comprises a conductive post, and a seed layer laterally covering the conductive post;
- a passivation layer over the substrate and laterally encapsulating a lower portion of the connector;
- a protection layer over the passivation layer and laterally encapsulating an upper portion of the connector, wherein a portion of the seed layer leans on a top surface of the passivation layer.
A package structure, comprising:
- a first die comprising a first connector and a first protection layer laterally aside the first connector, wherein the first connector comprises a first conductive post and a first seed layer laterally covering the first conductive post;
- an encapsulant laterally encapsulating the first die, wherein a top surface of the encapsulant is substantially coplanar with a top surface of the first seed layer;
- and
- a redistribution structure, electrically coupled to the first die.
A package structure, comprising:
- a first die;
- an encapsulant laterally encapsulating the first die;
- a redistribution structure disposed over the encapsulant and the first die, wherein the redistribution structure comprises a polymer layer, and a via extending through the polymer layer and connected to the first die, wherein the polymer layer comprises an extending portion extending into the encapsulant, and a bottommost surface of the extending portion is lower than a bottommost surface of the via.
Dependencies are inferred from the claim text.