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US 12,696,789 B2Granted
Method of manufacturing an electronic device and electronic device manufactured thereby
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsBora Baloglu, Curtis Zwenger, Ronald Huemoeller
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Abstract
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.
Claims20
A method of manufacturing an electronic device, the method comprising:
- providing an interposer comprising an interposer first side, an interposer second side opposite the interposer first side;
- providing a semiconductor die comprising a semiconductor die first side, a semiconductor die second side opposite the semiconductor die first side, and semiconductor die lateral sides between the semiconductor die first side and the semiconductor die second side, wherein the semiconductor die second side is coupled to the interposer first side;
- encapsulating at least the semiconductor die lateral sides with an encapsulating material that covers and contacts the semiconductor die lateral sides and at least a portion of the interposer first side;
- and
- providing an interconnection structure comprising an interconnection structure first side and an interconnection structure second side opposite the interconnection structure first side, wherein the interconnection structure first side is coupled to the interposer second side.
2 more elements
A method of manufacturing an electronic device, the method comprising:
- providing a semiconductor die comprising a semiconductor die first side, a semiconductor die second side opposite the semiconductor die first side, and semiconductor die lateral sides between the semiconductor die first side and the semiconductor die second side;
- providing an encapsulating material that encapsulates and contacts at least the semiconductor die lateral sides;
- and
- providing a signal redistribution structure comprising a signal redistribution structure first side and a signal redistribution structure second side, wherein the signal redistribution structure first side is opposite the signal redistribution structure second side and is coupled to the semiconductor die second side;
- and
- coupling an interconnection structure to the signal redistribution structure second side.
3 more elements
Dependencies are inferred from the claim text.