Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device

A method for producing a semiconductor device, comprising:

• forming a temporary fixing laminated body comprising a carrier, and a sealing structure body provided on a main surface of the carrier, the sealing structure body comprising a plurality of semiconductor chips and a sealing portion sealing the plurality of semiconductor chips;
• and
• removing the carrier from the temporary fixing laminated body,
• wherein the semiconductor chip comprises a chip main body having a first surface and a second surface on a side opposite to the first surface, and a connection terminal provided on the first surface,
• the sealing portion comprises a protective layer covering the second surface of the plurality of semiconductor chips, and a sealing material layer sealing the plurality of semiconductor chips together with the protective layer,
• the protective layer is a curable resin film that is cured,
• the temporary fixing laminated body is formed by a method including providing a laminated body of the curable resin film and the carrier, and adhering the curable resin film and
• the carrier in the laminated body, the carrier is removed from the temporary fixing laminated body by separating the protective layer from the carrier,
• the curable resin film exhibits a transmittance of 20% or less with respect to light at a wavelength of 355 nm when cured, and
• the carrier is a glass substrate or a transparent resin substrate.

A method for producing a semiconductor device, comprising:

• forming a temporary fixing laminated body comprising a carrier, and a sealing structure body provided on a main surface of the carrier, the sealing structure body comprising a plurality of semiconductor chips and a sealing portion sealing the plurality of semiconductor chips;
• and
• removing the carrier from the temporary fixing laminated body,
• wherein the semiconductor chip comprises a chip main body having a first surface and a second surface on a side opposite to the first surface, and a connection terminal provided on the first surface,
• the sealing portion comprises an integrated protective layer covering the second surface of the plurality of semiconductor chips, and a sealing material layer sealing the plurality of semiconductor chips together with the protective layer,
• the protective layer is a curable resin film that is cured,
• the carrier is removed from the temporary fixing laminated body by separating the protective layer from the carrier,
• the curable resin film exhibits a transmittance of 20% or less with respect to light at a wavelength of 355 nm when cured, and
• wherein the temporary fixing laminated body is formed by:
• forming a precursor temporary fixing laminated body comprising a temporary fixing material, the plurality of semiconductor chips temporarily fixed onto the temporary fixing material, in a direction in which the first surface is directed toward the temporary fixing material side, and the sealing material layer sealing the plurality of semiconductor chips on the temporary fixing material, the second surface of the plurality of semiconductor chips being exposed from the sealing material layer;
• providing the curable resin film covering the second surface and the sealing material layer;
• adhering the carrier to the curable resin film;
• forming the protective layer by curing the curable resin film;
• and
• removing the temporary fixing material from the precursor temporary fixing laminated body, in this order, to obtain the temporary fixing laminated body.