Electrolytic method for carrier wafer separation
AssigneeMicron Technology, Inc.
InventorsMatthew Thorum, Farrell M. Good, Srinivasa Reddy Yeduru, Guohua Wei, Gurtej S. Sandhu
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Abstract
Electrolytic methods for carrier wafer separation are disclosed herein. In some embodiments, the method includes depositing a coating on a carrier wafer. The coating can include a first electrode layer, a second electrode layer, and a metal oxide layer between the first and second electrode layers. The method can further include attaching a device wafer to the coating, processing the device wafer, and applying a bias voltage to the first and second electrode layers. Applying the bias voltage can separate the device wafer from the carrier wafer.
Claims20
A method comprising:
- depositing a coating on a carrier wafer, wherein the coating includes a first electrode layer, a second electrode layer, and a metal oxide layer between the first and second electrode layers;
- attaching a device wafer to the coating;
- processing the device wafer;
- and
- applying a bias voltage to the first and second electrode layers, wherein applying the bias voltage separates the device wafer from the carrier wafer.
A semiconductor device, comprising:
- a device wafer;
- and
- a portion of an electrode layer disposed on the device wafer, wherein the portion of the electrode layer comprises a part of a coating, wherein the coating is configured to be deposited on a carrier wafer, and wherein the device wafer is configured to be attached to the coating during manufacturing of the semiconductor device.
A semiconductor device manufacturing system, the system comprising:
- a carrier wafer;
- a coating deposited on the carrier wafer, wherein the coating includes:
- a first electrode layer;
- a second electrode layer;
- and
- a metal oxide layer between the first and second electrode layers;
- and
- a device wafer attached to the coating,
- wherein the device wafer is configured to separate from the carrier wafer upon application of a bias voltage to the first and second electrode layers.
Dependencies are inferred from the claim text.