Packaging methods and structures using a die attach film
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui-Pin Hung, Jing-Cheng Lin, Nai-Wei Liu, Chin-Chuan Chang, Chen-Hua Yu, Shin-Puu Jeng, Chin-Fu Kao, Yi-Chao Mao, Szu Wei Lu
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Abstract
Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
Claims20
A method of packaging a semiconductor device, the method comprising:
- providing a carrier wafer;
- forming a die attach film (DAF) over the carrier wafer, the DAF comprising a polymer;
- attaching a plurality of dies to the DAF;
- packaging the plurality of dies;
- removing at least the carrier wafer from the packaged dies;
- and
- singulating the packaged dies after removal of the carrier, each of the packaged dies retaining a segment of the die attach film after singulation.
A method of packaging a semiconductor device, the method comprising:
- providing a carrier wafer;
- forming a die attach film (DAF) over the carrier wafer, the DAF comprising a thermoplastic material;
- attaching a plurality of dies to the DAF;
- forming a molding compound over the plurality of dies and exposed portions of the DAF;
- removing the molding compound at least from a top surface of the plurality of dies;
- forming a redistribution layer (RDL) over the top surface of the plurality of dies;
- forming a plurality of solder balls over portions of the RDL;
- removing at least the carrier wafer;
- providing an interposer including a plurality of through-vias disposed at a surface thereof;
- coupling the plurality of dies to the interposer proximate the through-vias;
- and
- removing a portion of a back side of the interposer to expose the through-vias of the interposer, before removing at least the carrier wafer.
A packaged semiconductor device, comprising:
- at least one die;
- a wiring layer coupled to a first side of the at least one die;
- a die attach film (DAF) coupled to a second side of the at least one die, the DAF extending laterally beyond the die and comprising a polymer;
- and
- a molding compound disposed between the wiring layer and the DAF proximate edges of the at least one die, a first surface of the molding compound level with the first surface of the at least one die, the molding compound engaging a first surface of the die attach film disposed laterally beyond the die, a sidewall of the DAF being coplanar with a sidewall of the molding compound such that the sidewall of the DAF is directly above the sidewall of the molding compound.
Dependencies are inferred from the claim text.