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US 12,757,685 B2Granted
Semiconductor manufacturing device, wafer mounting device, dicing device, and semiconductor manufacturing method
AssigneeMitsubishi Electric Corporation
InventorOsamu Zaima
Life of this patent
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Abstract
An object is to provide a technique capable of suppressing unevenness of force applied to a dicing blade in cutting an orientation flat. A semiconductor manufacturing device includes a stage and a transport machine. A semiconductor wafer including an orientation flat and a jig having a shape corresponding to the orientation flat to be used for cutting the orientation flat by a dicing blade are fixed to each other by a dicing tape on the stage. The transport machine transports the jig so that the jig faces the orientation flat on the stage.
Claims13
A semiconductor manufacturing system, comprising:
- a jig;
- a stage on which a semiconductor wafer and the jig are fixed to each other by a dicing tape, the semiconductor wafer including an orientation flat, the jig having a shape corresponding to the orientation flat, the jig to be used for cutting the semiconductor wafer along the orientation flat by a dicing blade;
- and
- a transport machine configured to transport the jig so that the jig faces the orientation flat on the stage.
1 more element
Dependencies are inferred from the claim text.