H10P 72/741
The auxiliary support including a cavity for storing a finished or partly
Official title: {the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip}
H10P72/741 (The auxiliary support including a cavity for storing a finished or partly) appears on 307 US grants and 257 published applications in this corpus.
Search patents in H10P- Granted patents
- 307
- Published applications
- 257
- Assignees
- 177
- Inventors
- 685
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 4 | 0 |
| 2000 | 15 | 0 |
| 2001 | 18 | 7 |
| 2002 | 16 | 11 |
| 2003 | 9 | 11 |
| 2004 | 7 | 10 |
| 2005 | 5 | 6 |
| 2006 | 8 | 11 |
| 2007 | 7 | 2 |
| 2008 | 4 | 6 |
| 2009 | 0 | 7 |
| 2010 | 4 | 1 |
| 2011 | 5 | 6 |
| 2012 | 4 | 1 |
| 2013 | 6 | 4 |
| 2014 | 3 | 4 |
| 2015 | 3 | 5 |
| 2016 | 5 | 6 |
| 2017 | 5 | 18 |
| 2018 | 15 | 13 |
| 2019 | 12 | 18 |
| 2020 | 15 | 17 |
| 2021 | 13 | 17 |
| 2022 | 22 | 27 |
| 2023 | 15 | 24 |
| 2024 | 12 | 10 |
| 2025 | 19 | 10 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Apparatus for processing of singulated dies and methods for using the same5 May 2026US 12,622,222 B2Adeia Semiconductor Bonding Technologies Inc.
- Multichip module supports and related methods5 May 2026US 12,622,312 B2Semiconductor Components Industries, LLC
- Method for manufacturing semiconductor package10 Feb 2026US 12,550,654 B2Advanced Semiconductor Engineering, Inc.
- Mass transfer device and mass transfer system27 Jan 2026US 12,538,750 B2Century Technology (Shenzhen) Corporation Limited
- Film tray semiconductor chip carrier17 Sep 2026US 2026/0282817 A1Arm Limited
- Methods of manufacturing device packages using singulated die carriers13 Aug 2026US 2026/0239922 A1Adeia Semiconductor Bonding Technologies Inc.
- Populous carrier tape14 May 2026US 2026/0136886 A1
- Mass transfer method7 May 2026US 2026/0130175 A1Century Technology (Shenzhen) Corporation Limited
- Method of fabricating semiconductor package using paraffin-based fixing film16 Apr 2026US 2026/0107740 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Stacked chip process carrier226US 6,279,815 B1International Business Machines Corporation · 2001
- Spacer trays for stacking storage trays with integrated circuits189US 5,335,771 AR. H. Murphy Co., Inc. · 1994
- Transfer assembly for manufacturing electronic devices130US 7,244,326 B2Alien Technology Corporation · 2007
- Shaped, self-aligning micro-bump structures123US 5,477,086 ALSI Logic Corporation · 1995
- Flexible high density interconnect structure and flexibly interconnected system115US 5,452,182 AMartin Marietta Corporation · 1995