Method of assembly by direct bonding of electronic components
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsFrank Fournel, Christophe Morales, Loïc Sanchez, Brigitte Montmayeul
Life of this patent
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Abstract
A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.
Claims16
Method of preparation of a first surface of an electronic component, said first surface being intended to be bonded to another electronic component by a direct bonding and said first surface having previously been submitted to a surface treatment in an atmosphere comprising nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method comprising:
- treating the first surface and a sub-surface under the first surface by placing into contact said first surface with an aqueous solution comprising at least 90% of water by mass, for a contacting duration longer than or equal to 30 minutes to remove a portion of the nitrogen used in the surface treatment from said first surface and sub-surface;
- and then
- the drying of said first surface.
Dependencies are inferred from the claim text.