Flexible high density interconnect structure and flexibly interconnected system
AssigneeMartin Marietta Corporation
InventorsCharles W. Eichelberger, William P. Kornrumpf, Robert J. Wojnarowski
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Abstract
A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.
Claims17
An electronic system comprising:
- an electronic component having a major surface having contact pads disposed thereon;
- an interconnection structure of greater extent than said electronic component fabricated in part on said electronic component, said interconnection structure including
- a layer of flexible dielectric material, and
- a plurality of flexible conductors supported by said dielectric layer;
- said interconnection structure including a flexible portion which is free of rigid support and which is free to bend, and a non-flexible portion which is constrained from bending;
- and
- said dielectric of said interconnection structure being bonded to said major surface of said electronic component in said non-flexible portion of said interconnection structure, selected ones of said contact pads being connected to selected ones of said flexible conductors.
An electronic system comprising:
- a rigid substrate;
- an electronic component having a major surface having contact pads disposed thereon, said electronic component being bonded to said substrate;
- an interconnection structure of greater extent than said rigid substrate fabricated in part on said electronic component and said substrate, said interconnection structure including
- a layer of flexible dielectric material, and
- a plurality of flexible conductors supported by said dielectric layer;
- said interconnection structure including a flexible portion which is free of rigid support and which is free to bend, and said dielectric layer being bonded to said substrate and said major surface of said electronic component to define a non-flexible portion of said interconnection structure which is constrained from bending;
- and
- selected ones of said contact pads being connected to selected ones of said flexible conductors.
A high density interconnect structure comprising:
- a plurality of electronic components each having a major surface with contact pads disposed thereon;
- an interconnect structure fabricated in part on said electronic components and including
- at least one dielectric layer, said dielectric layer being bonded to the major surfaces of said electronic components, and
- at least one patterned conductor layer;
- selected ones of said contact pads being connected to selected conductors of said patterned layer such that said conductors interconnect said electronic components;
- said interconnect structure including a flexible portion which is free of rigid support and which is free to bend, and non-flexible portions which are constrained from bending, said non-flexible portions being bonded to said electronic components, and
- at least some of said electronic components being free of external substrates.
Dependencies are inferred from the claim text.