Methods of manufacturing device packages using singulated die carriers

A method of manufacturing a device package, the method comprising:

• using a first carrier and a second carrier to manufacture the device package, wherein each carrier is configured to support a plurality of singulated dies in an array of die pocket regions, the first and second carriers each comprising:
• a carrier plate having a plurality of openings;
• and
• one or more alignment features, wherein
• each of the openings is defined by one or more sidewalls that extend from a first surface towards an opposite second surface,
• each of the sidewalls comprises one or more protuberances that extend laterally into a respective opening to collectively determine a boundary of a die pocket region,
• the boundary of the die pocket region corresponds to a size and shape of a singulated die to-be-received therein,
• at least three of the protuberances comprises a die supporting surface disposed beneath the die pocket region, and
• when engaged with the one or more alignment features of the other carrier, the alignment features cause the die pocket regions of the respective arrays to be aligned.