Stacked chip process carrier
AssigneeInternational Business Machines Corporation
InventorsGeorge C. Correia, John E. Cronin, Edmund J. Sprogis
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Abstract
The present invention provides an apparatus and methods for holding a first semiconductor device in proper alignment to a second semiconductor device, whose size is different from the first device, while performing a C4 bond between the two devices. The apparatus for holding the two devices in proper alignment consists of a holding fixture, which includes upper and lower pocket receptacles for receiving the semiconductor devices. The semiconductor devices are placed into the respective upper and lower slots aligned to two or more edges of the holding fixture.
Claims11
A method of joining a first semiconductor device and a second semiconductor device in a fixture having a lower pocket and an upper pocket, wherein the upper pocket is aligned to the lower pocket, the method steps comprising:
- a) providing the first device in the lower pocket;
- b) aligning the first device to the lower pocket on at least two sides;
- c) providing the second device in the upper pocket;
- d) aligning the second device to the upper pocket on at least two sides;
- e) joining the first device to the second device.
Dependencies are inferred from the claim text.