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US 7,244,326 B2Granted
Transfer assembly for manufacturing electronic devices
AssigneeAlien Technology Corporation
InventorsGordon S. W. Craig, Kenneth D. Schatz, Mark A. Hadley, Paul S. Drzaic
Life of this patent
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Abstract
A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
Claims64
A method for assembling a device comprising:
- placing a functional element in a first opening formed in a template substrate using a fluidic self-assembly process (FSA) and a web process;
- and
- transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the top of the device substrate, wherein said transferring includes pressing the adhesive film through the second opening so that an adhesive side of the adhesive film adheres to the functional element through the second opening and transfers the functional element out of the first opening in the template substrate into the second opening of the device substrate.
A method for assembling a device comprising:
- transferring a first functional element to a device substrate having a first opening formed therein, the first functional element is held within the first opening and against an adhesive film coupled to the top of the device substrate and the first functional element is transferred to the first opening from a first template substrate having the first functional element deposited therein;
- and
- transferring a second functional element to the device substrate having a second opening formed therein, the second functional element is held within the second opening and against the adhesive film coupled to the top of the device substrate and the second functional element is transferred to the second opening from a second template substrate having the second functional element deposited therein;
- wherein
- transferring the first functional element to the first opening comprises pressing the adhesive film through the first opening so that an adhesive side of the adhesive film adheres to the first functional element and transfers the first functional element out of the first opening in the template substrate into the first opening of the device substrate transferring of the first functional element tc the device substrate;
- and
- transferring the second functional element to the second opening comprises pressing the adhesive film through the second opening so that an adhesive side of the adhesive film adheres to the second functional element and transfers the second functional element out of the second opening in the second template substrate into the second opening of the device substrate.
4 more elements
A method for assembling a device, the method comprising:
- placing a plurality of functional elements in a corresponding plurality of first openings formed in a first substrate;
- transferring only a portion of said plurality of functional elements to a second substrate having at least one second opening, wherein an adhesive film is coupled to the top of said second substrate and having at least a portion exposed in said at least one second opening in said second substrate and wherein said transferring comprises pressing said adhesive film through said second opening such that an adhesive side of said adhesive film adheres to the portion of said plurality of functional elements and transfer the portion of said plurality of functional elements out of its location in the plurality of first openings in the first substrate to said at least one second opening in the second substrate.
A method for assembling a device comprising:
- transferring a functional element to a device substrate having an opening formed therein wherein the functional element is held within the opening and against an adhesive film coupled to the device substrate, and wherein the functional element is transferred from a plurality of functional elements that are disposed on a handle substrate format and temporarily held in place on the handle substrate, wherein the adhesive film is coupled to the top of said device substrate and having at least a portion over the opening exposed to contact said functional element and wherein said transferring comprises pressing said exposed adhesive film over the opening toward said handle substrate such that an adhesive side of said adhesive film adheres to said functional element and transfers said functional element disposed on the handle substrate into the opening of said device substrate.
A method for assembling a device comprising:
- transferring a functional element to a first opening in a template substrate, the first opening selected from a set of openings formed on the template substrate, the functional element selected from a set of functional elements that are disposed on a handle substrate and temporarily held in place on the handle substrate, the set of openings having a pattern matching the pattern of the set of functional elements on the handle substrate;
- and
- transferring the functional element from the first opening to a second opening formed therein in a device substrate, the device substrate having an adhesive film coupled thereto, the adhesive film holding the functional element against the second opening;
- wherein the adhesive film is coupled to the top of said device substrate and having at least a portion exposed to contact said functional element and wherein said transferring comprises pressing said adhesive film toward said handle substrate such that an adhesive side of said adhesive film adheres to said functional element and transfers the functional element from the handle substrate to said device substrate.
1 more element
The method of 56 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.
Dependencies are inferred from the claim text.