Method for manufacturing semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHsu-Nan Fang
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a method for manufacturing a semiconductor package. The method includes disposing a first semiconductor substrate on a temporary carrier and dicing the first semiconductor substrate to form a plurality of dies. Each of the plurality of dies has an active surface and a backside surface opposite to the active surface. The backside surface is in contact with the temporary carrier and the active surface faces downward. The method also includes transferring one of the plurality of dies from the temporary carrier to a temporary holder. The temporary holder only contacts a periphery portion of the active surface of the one of the plurality of dies.
Claims16
A method for manufacturing a semiconductor package, comprising:
- providing a die under a mounting surface of a carrier, wherein the die has a backside surface facing the mounting surface of the carrier, an active surface facing away from the mounting surface of the carrier, and an electrical contact exposed at the active surface;
- ejecting the die from the carrier to land on a temporary holder;
- moving a bonding device to a space between the backside surface of the die and the carrier;
- holding the die by the bonding device from the backside surface of the die;
- transferring the die and the bonding device to be under a bonding surface of a target substrate, wherein both of the mounting surface of the carrier and the bonding surface of the target substrate face downward, and wherein the active surface of the die remains facing downward while transferring the die to be under the bonding surface of the target substrate;
- flipping the die under the bonding surface of the target substrate;
- and
- bonding the active surface of the die to the bonding surface of the target substrate.
A method for manufacturing a semiconductor package, comprising:
- providing a plurality of dies side-by-side on a same substantially planar surface of a carrier, wherein respective backside surfaces of the plurality of dies are substantially aligned in a direction parallel to the same substantially planar surface, and wherein respective active surfaces of the plurality of dies face away from the carrier;
- flipping the plurality of dies mounted on the carrier so that the respective active surfaces of the plurality of dies change from facing upward to facing downward;
- and
- transferring a die of the plurality of dies to be under a target substrate;
- and
- prior to transferring the die of the plurality of dies to be under the target substrate, ejecting the die from the carrier to land on a temporary holder;
- and
- after ejecting the die from the carrier to land on the temporary holder, moving the temporary holder down and away from the carrier;
- and
- after moving the temporary holder down and away from the carrier, moving a bonding device to a space between the backside surface of the die and the carrier.
Dependencies are inferred from the claim text.