H10P 72/7448
The bond interface between the auxiliary support and the wafer comprising two
Official title: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer}
H10P72/7448 (The bond interface between the auxiliary support and the wafer comprising two) appears on 374 US grants and 463 published applications in this corpus.
Search patents in H10P- Granted patents
- 374
- Published applications
- 463
- Assignees
- 130
- Inventors
- 712
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 3 |
| 2005 | 1 | 4 |
| 2006 | 1 | 2 |
| 2007 | 2 | 4 |
| 2008 | 5 | 3 |
| 2009 | 1 | 6 |
| 2010 | 2 | 11 |
| 2011 | 6 | 13 |
| 2012 | 4 | 5 |
| 2013 | 3 | 18 |
| 2014 | 15 | 32 |
| 2015 | 29 | 45 |
| 2016 | 38 | 54 |
| 2017 | 38 | 51 |
| 2018 | 46 | 30 |
| 2019 | 31 | 27 |
| 2020 | 34 | 26 |
| 2021 | 21 | 20 |
| 2022 | 25 | 35 |
| 2023 | 12 | 23 |
| 2024 | 17 | 24 |
| 2025 | 25 | 15 |
| 2026 | 14 | 10 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Method for providing a workpiece support unit for supporting a workpiece2 Jun 2026US 12,643,184 B2Disco Corporation
- Article and method for temporary bonding of substrates26 May 2026US 12,636,872 B2Corning Incorporated
- Multi-layer release stack for light induced transfer of components12 May 2026US 12,628,482 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Hybrid release layer for microdevice cartridge31 Mar 2026US 12,593,656 B2VueReal Inc.
- Carrier for laser die transfer, wafer assembly, and pick and place apparatus comprising the same6 Aug 2026US 2026/0231730 A1Nexperia B. V.
- Hybrid release layer for microdevice cartridge9 Jul 2026US 2026/0198265 A1VueReal Inc.
- Apparatus and method for forming and releasing substrate stack from carrier2 Jul 2026US 2026/0190944 A1Marvell Asia Pte Ltd
- Direct bonding and debonding of carrier25 Jun 2026US 2026/0182477 A1Adeia Semiconductor Bonding Technologies Inc.
- Manufacturing method of chip-attached substrate14 May 2026US 2026/0136857 A1Tokyo Electron Limited
Most cited
By later US patents
- Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method924US 6,372,608 B1Seiko Epson Corporation · 2002
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same714US 6,645,830 B2Seiko Epson Corporation · 2003
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same674US 6,818,530 B2Seiko Epson Corporation · 2004
- Processing stacked substrates172US 10,707,087 B2Invensas Bonding Technologies, Inc. · 2020
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same163US 7,094,665 B2Seiko Epson Corporation · 2006