H10P 72/745
The bond interface between the auxiliary support and the wafer comprises three
Official title: {the bond interface between the auxiliary support and the wafer comprises three or more layers}
H10P72/745 (The bond interface between the auxiliary support and the wafer comprises three) appears on 22 US grants and 36 published applications in this corpus.
Search patents in H10P- Granted patents
- 22
- Published applications
- 36
- Assignees
- 26
- Inventors
- 77
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 2 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 6 |
| 2023 | 1 | 9 |
| 2024 | 1 | 5 |
| 2025 | 4 | 5 |
| 2026 | 9 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Method for providing a workpiece support unit for supporting a workpiece2 Jun 2026US 12,643,184 B2Disco Corporation
- Article and method for temporary bonding of substrates26 May 2026US 12,636,872 B2Corning Incorporated
- Multi-layer release stack for light induced transfer of components12 May 2026US 12,628,482 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Hybrid release layer for microdevice cartridge31 Mar 2026US 12,593,656 B2VueReal Inc.
- Hybrid release layer for microdevice cartridge9 Jul 2026US 2026/0198265 A1VueReal Inc.
- Direct bonding and debonding of carrier25 Jun 2026US 2026/0182477 A1Adeia Semiconductor Bonding Technologies Inc.
- Method for manufacturing semiconductor device using gas blowing agent30 Apr 2026US 2026/0116060 A1Samsung Electronics Co., Ltd.
- Power Semiconductor Apparatus and Bonding Method Thereof9 Apr 2026US 2026/0101731 A1Diodes Incorporated
- Multi-layer system comprising thin layers for temporary bonding20 Nov 2025US 2025/0357175 A1EV Group E. Thallner GmbH
Most cited
By later US patents
- Sticking method and sticking apparatus5US 8,298,365 B2Tokyo Ohka Kogyo.Co., Ltd. · 2012
- Method of bonding, thinning, and releasing wafer2US 8,080,121 B2Tokyo Ohka Kogyo.Co., Ltd. · 2011
- Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer1US 10,106,713 B2Shin-Etsu Chemical Co., Ltd. · 2018
- Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer1US 10,242,902 B2Shin-Etsu Chemical Co., Ltd. · 2019
- Methods and system for processing semiconductor device structures1US 10,403,598 B2Micron Technology, Inc. · 2019