Article and method for temporary bonding of substrates

Abstract

Articles and methods for temporary bonding of substrates are described. The articles include a photo-release layer to enable reversal of the temporary bonding upon exposure of the photo-release layer to light to separate the substrates. The method includes plasma treatment of the photo-release layer to increase the bonding energy. Higher bonding energy allows for processing of the article with greater mechanical force before separation. Plasma treatment also allows for temporary bonding with a thinner photo-release layer and a photo-release layer with low total thickness variation (TTV). Once separated from the article, a processed substrate can be bonded to other substrates.

Dependencies are inferred from the claim text.