Electronic component manufacturing method, manufacturing film, and manufacturing tool

An electronic component manufacturing method comprising:

• a segmentation step of segmenting a precursor electronic component on a support different from the support used in the arrangement step to obtain electronic components;
• an arrangement step of arranging, on a support having a substrate and a holding layer that has a characteristic in which its holding force decreases upon heat application or energy-ray irradiation, 300 or more of the electronic components, each having exposed electrodes, via the holding layer;
• and
• an evaluation step of evaluating electric characteristics of 300 or more of the electronic components arranged on the support by simultaneously connecting the exposed electrodes and probes and performing conduction evaluation while the electronic components are heated to 150° C. or higher;
• wherein the substrate is formed using a heat-resistant resin, has a melt peak temperature of 200° C. or higher as measured in accordance with JIS K7121 Industrial Standard, and has a tensile elastic modulus E′ (160) of 100 MPa or more at a temperature of 160° C., and
• wherein the holding layer is formed of an adhesive, and the adhesive has a 180° peeling adhesive force of 0.3 N/25 mm or more and 8 N/25 mm or less, measured in accordance with JISZ0237 except that the adherend used in the measurement is a silicon wafer.