Multi-layer release stack for light induced transfer of components

A method for light induced transfer of components from a donor substrate to an acceptor substrate, wherein the donor substrate comprises:

• a transparent carrier configured to carry the components facing the acceptor substrate, and
• a release stack disposed between the transparent carrier and the components for releasing one or more of the components from the donor substrate onto the acceptor substrate following illumination of the release stack by a light beam through the transparent carrier, wherein the release stack comprises:
• a melt layer having a melting temperature,
• a light-absorbing layer disposed between the transparent carrier and the melt layer, wherein the light-absorbing layer has an absorption coefficient for absorbing the light beam thereby causing the light-absorbing layer to be heated, wherein the heated light-absorbing layer is in thermal contact with the melt layer for conducting its heat to the melt layer thereby causing a temperature of the melt layer to rise above its melting temperature, wherein the light-absorbing layer has a melting temperature which is higher than the melting temperature of the melt layer such that the light-absorbing layer can remain solid while the melt layer is melted by the heat conducted from the light-absorbing layer,
• a decomposition layer, disposed between the melt layer and the light-absorbing layer, wherein the decomposition layer has an evaporation temperature which is higher than a melting temperature of the melt layer and which is lower than a melting temperature of the light-absorbing layer, and wherein a layer thickness of the decomposition layer is smaller than a layer thickness of the melt layer;
• and
• an adhesive layer adhering the components to the melt layer while the melt layer is solid and releasing adhesion when the melt layer is melted;
• the method comprising illuminating an area of the light-absorbing layer, forming a part of the release stack holding a respective component, with a light beam through the transparent carrier to heat a respective part of the light-absorbing layer, wherein the heat is conducted to the melt layer of the release stack via the decomposition layer thereby melting the melt layer and heating the decomposition layer while the respective part of the light-absorbing layer remains solid, wherein the melting of the melt layer causes a loss of adhesion between the melt layer and a respective part of the adhesive layer of the release stack adhering the respective components to the melt layer, wherein the loss of adhesion causes release and transfer of the respective component, and wherein the heating of the decomposition layer causes local gas production resulting in bubble-formation in the decomposition layer, thereby accelerating the loss of adhesion between the melt layer and a respective part of the adhesive layer.