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US 12,593,656 B2Granted
Hybrid release layer for microdevice cartridge
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Lauren Lesergent
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Abstract
This disclosure is related to integrating pixelated microdevices into a system substrate to develop a functional system such as display, sensors, and other optoelectronic devices. The process may involve having a structure of release layers in the housing and then using different decoupling mechanisms for release. The release layers are not limited to but can be a combination of chemical or optical or mechanical release layers.
Claims17
A microdevice transfer method for integrating microdevices into a system substrate the method comprising:
- having a microdevice in a donor substrate;
- providing a housing layer between the microdevice and the donor substrate;
- providing a release layer, the release layer adjoining the micro device and housing layer and disposed therebetween;
- decoupling the release layer by a chemical, an optical or a mechanical process, prior to transfer of the microdevice into a system backplane;
- and
- transferring the housing layer into a temporary substrate using bonding layers and forming access holes in the housing layer.
3 more elements
Dependencies are inferred from the claim text.