Sticking method and sticking apparatus
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsHirofumi Imai, Koki Tamura, Takahiro Asai, Takahiro Yoshioka, Yoshihiro Inao
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Abstract
A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.
Claims11
A sticking method for sticking a support plate onto a substrate, the method comprising:
- a step of sticking the support plate onto the substrate via a first adhesive layer provided on the substrate, a separation film layer provided on the first adhesive layer, and a second adhesive layer provided on the separation film layer,
- wherein the first adhesive layer and the second adhesive layer dissolve in a solvent and the second adhesive layer is higher in rate of dissolution in the solvent than the first adhesive layer, or wherein the second adhesive layer dissolves in a solvent different from a solvent in which the first adhesive layer dissolves, and
- wherein the separation film layer is formed from a resin selected from the group consisting of a polyethylene resin, a polyimide resin (PI), a polyamide resin, polyethylene terephthalate (polyester resin (PET)), polyphenylene sulfide, polyethylene naphthalate (PEN), polypropylene resin, polybutylene resin, nylon, and a polylactide resin.
A sticking method for sticking a support plate onto a wafer, the method comprising:
- a step of sticking the support plate onto the wafer via a first adhesive layer provided on the wafer, a separation film layer provided on the first adhesive layer, and a second adhesive layer provided on the separation film layer,
- wherein the first adhesive layer and the second adhesive layer dissolve in a solvent and the second adhesive layer is higher in rate of dissolution in the solvent than the first adhesive layer, or wherein the second adhesive layer dissolves in a solvent different from a solvent in which the first adhesive layer dissolves, and
- wherein the separation film layer is formed from a resin selected from the group consisting of a polyethylene resin, a polyimide resin (PI), a polyamide resin, polyethylene terephthalate (polyester resin (PET)), polyphenylene sulfide, polyethylene naphthalate (PEN), polypropylene resin, polybutylene resin, nylon, and a polylactide resin.
Dependencies are inferred from the claim text.