Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

A temporary adhesive material for a wafer processing, the temporary adhesive material being used for temporarily bonding a support and a wafer having a front surface on which a circuit is formed and a back surface to be processed, comprising:

• a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer (A) capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and capable of releasably adhering to the support, wherein
• the non-silicone thermoplastic resin layer (A) is an elastomer selected from the group consisting of an olefin type thermoplastic elastomer, a polybutadiene type thermoplastic elastomer, a styrene type thermoplastic elastomer, a styrene-butadiene type thermoplastic elastomer, and a styrene-polyolefin type thermoplastic elastomer,
• the thermosetting siloxane polymer layer (B) is a cured layer of a composition containing:
• (B-1) an organopolysiloxane having two or more alkenyl groups per molecule;
• (B-2) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms (Si—H groups) per molecule, in such an amount that a mole ratio of the Si—H group in the component (B-2) to the alkenyl group in the component (B-1) ranges from 0.3 to 10;
• and
• (B-3) a platinum-based catalyst, and
• the thermosetting siloxane-modified polymer layer (C) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit shown by the following general formula (3) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of one or more crosslinkers selected from the group consisting of a phenol compound having on average two or more phenol groups per molecule and an epoxy compound having on average two or more epoxy groups per molecule,
• wherein R1 to R4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms;
• “m” is an integer of 1 to 100;
• B is a positive number;
• A is 0 or a positive number, provided that A+B=1;
• and Y is a divalent organic group shown by the following general formula (4),
• wherein V represents a divalent organic group selected from any of
• “p” represents 0 or 1;
• R7 and R8 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other;
• and “h” represents any of 0, 1, and 2.

A wafer processing laminate comprising a support, a temporary adhesive material layer formed on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, wherein

• the temporary adhesive material layer comprises a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer (A) releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and releasably adhering to the support, and wherein
• the non-silicone thermoplastic resin layer (A) is an elastomer selected from the group consisting of an olefin type thermoplastic elastomer, a polybutadiene type thermoplastic elastomer, a styrene type thermoplastic elastomer, a styrene-butadiene type thermoplastic elastomer, and a styrene-polyolefin type thermoplastic elastomer,
• the thermosetting siloxane polymer layer (B) is a cured layer of a composition containing:
• (B-1) an organopolysiloxane having two or more alkenyl groups per molecule;
• (B-2) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms (Si—H groups) per molecule, in such an amount that a mole ratio of the Si—H group in the component (B-2) to the alkenyl group in the component (B-1) ranges from 0.3 to 10;
• and
• (B-3) a platinum-based catalyst, and
• the thermosetting siloxane-modified polymer layer (C) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit shown by the following general formula (1) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of one or more crosslinkers selected from the group consisting of an amino condensate, a melamine resin, a urea resin each modified with formalin or formalin-alcohol, a phenol compound having on average two or more methylol or alkoxymethylol groups per molecule, and an epoxy compound having on average two or more epoxy groups per molecule,
• wherein R1 to R4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms;
• “m” is an integer of 1 to 100;
• B is a positive number;
• A is 0 or a positive number, provided that A+B=1;
• and X is a divalent organic group shown by the following general formula (2),
• wherein Z represents a divalent organic group selected from any of
• N represents 0 or 1;
• R5 and R6 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other;
• and “k” represents any of 0, 1, and 2.

A wafer processing laminate comprising a support, a temporary adhesive material layer formed on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, wherein

• the temporary adhesive material layer comprises a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of anon-silicone thermoplastic resin layer (A) releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and releasably adhering to the support, and wherein
• the non-silicone thermoplastic resin layer (A) is an elastomer selected from the group consisting of an olefin type thermoplastic elastomer, a polybutadiene type thermoplastic elastomer, a styrene type thermoplastic elastomer, a styrene-butadiene type thermoplastic elastomer, and a styrene-polyolefin type thermoplastic elastomer,
• the thermosetting siloxane polymer layer (B) is a cured layer of a composition containing:
• (B-1) an organopolysiloxane having two or more alkenyl groups per molecule;
• (B-2) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms (Si—H groups) per molecule, in such an amount that a mole ratio of the Si—H group in the component (B-2) to the alkenyl group in the component (B-1) ranges from 0.3 to 10;
• and
• (B-3) a platinum-based catalyst, and
• the thermosetting siloxane-modified polymer layer (C) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit shown by the following general formula (3) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of one or more crosslinkers selected from the group consisting of a phenol compound having on average two or more phenol groups per molecule and an epoxy compound having on average two or more epoxy groups per molecule,
• wherein R1 to R4 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms;
• “m” is an integer of 1 to 100;
• B is a positive number;
• A is 0 or a positive number, provided that A+B=1;
• and Y is a divalent organic group shown by the following general formula (4),
• wherein V represents a divalent organic group selected from any of
• “p” represents 0 or 1;
• R7 and R8 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other;
• and “h” represents any of 0, 1, and 2.