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US 2026/0198265 A1Published application
Hybrid release layer for microdevice cartridge
AssigneeVueReal Inc.
InventorsGholamreza CHAJI, Lauren LESERGENT
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Abstract
This disclosure is related to integrating pixelated microdevices into a system substrate to develop a functional system such as display, sensors, and other optoelectronic devices. The process may involve having a structure of release layers in the housing and then using different decoupling mechanisms for release. The release layers are not limited to but can be a combination of chemical or optical or mechanical release layers.
Claims1
A method of transferring microdevices for integration into a system substrate, comprising:
- providing a microdevice associated with a donor substrate;
- providing a housing layer relative to the microdevice;
- providing a release layer between the microdevice and the donor substrate;
- decoupling the release layer prior to transfer of the microdevice into a system backplane;
- and
- transferring the housing layer to a temporary substrate using one or more bonding layers and forming one or more access openings in the housing layer.
3 more elements
Dependencies are inferred from the claim text.