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US 2026/0136857 A1Published application
Manufacturing method of chip-attached substrate
AssigneeTokyo Electron Limited
InventorsHayato TANOUE, Yasutaka MIZOMOTO, Yohei YAMASHITA
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Abstract
A manufacturing method of a chip-attached substrate includes preparing a stacked substrate including multiple chips, a first substrate to which the multiple chips are temporarily bonded, and a second substrate bonded to the first substrate with the multiple chips therebetween; and separating the multiple chips bonded to the first substrate and the second substrate from the first substrate to bond the multiple chips to one surface of a third substrate including a device layer.
Claims14
A manufacturing method of a chip-attached substrate, comprising:
- bonding multiple chips to one surface of a first substrate by an intermolecular force;
- bonding the multiple chips bonded to the first substrate to a surface of a second substrate facing the first substrate;
- and
- thinning the multiple chips and uniformizing thicknesses of the multiple chips after the bonding of the multiple chips to the first substrate and before the bonding of the multiple chips to the second substrate.
1 more element
Dependencies are inferred from the claim text.