Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same

A method of manufacturing an active matrix substrate, comprising:

• depositing a separation layer over the substrate;
• forming a transferred layer, including a plurality of thin film transistors, above the substrate;
• causing exfoliation at at least one of the separation layer and an interface between the separation layer and the substrate, the transferred layer being removed from the substrate;
• transferring the transferred layer to the transfer member;
• removing a remainder of the separation layer from the substrate;
• and
• reusing the substrate for another transfer.

A transferring method, comprising:

• providing a substrate;
• depositing a separation layer over the substrate;
• forming a transferred layer over the substrate;
• joining a transfer member to the transferred layer;
• causing exfoliation at at least one of the separation layer and an interface between the separation layer and the substrate, the transferred layer being removed from the substrate;
• transferring the transferred layer to the transfer member;
• and
• the steps of joining the transfer member, removing the transferred layer and transferring the transferred layer constituting a transfer process, the transfer process being repeatedly performed such that a position of a front face and a rear face of the transferred layer formed by the last transfer process are the same as those of the transferred layer formed on the substrate.

A method for manufacturing an active matrix substrate, comprising:

• forming a separation layer over the substrate;
• forming a transferred layer, including a plurality of thin film transistors, above the substrate;
• joining a transfer member to the transferred layer;
• causing exfoliation at at least one of the separation layer and an interface between the separation layer and the substrate, the transferred layer being removed from the substrate;
• transferring the transferred layer to the transfer member;
• and
• the steps of joining the transfer member, removing the transferred layer and transferring the transferred layer constituting a transfer process, the transfer process being repeatedly performed such that a position of a front face and a rear face of the transferred layer formed by the last transfer process are the same as those of the transferred layer formed on the substrate.