H10P 72/7402
Wafer tapes
Official title: {Wafer tapes, e.g. grinding or dicing support tapes}
H10P72/7402 (Wafer tapes) appears on 3,814 US grants and 4,873 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,814
- Published applications
- 4,873
- Assignees
- 752
- Inventors
- 6,161
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 8 | 0 |
| 1998 | 14 | 0 |
| 1999 | 24 | 0 |
| 2000 | 22 | 0 |
| 2001 | 26 | 27 |
| 2002 | 46 | 65 |
| 2003 | 54 | 65 |
| 2004 | 58 | 84 |
| 2005 | 63 | 124 |
| 2006 | 61 | 104 |
| 2007 | 57 | 102 |
| 2008 | 54 | 118 |
| 2009 | 72 | 95 |
| 2010 | 94 | 144 |
| 2011 | 96 | 167 |
| 2012 | 99 | 188 |
| 2013 | 121 | 185 |
| 2014 | 156 | 230 |
| 2015 | 217 | 224 |
| 2016 | 220 | 263 |
| 2017 | 247 | 292 |
| 2018 | 212 | 311 |
| 2019 | 251 | 275 |
| 2020 | 284 | 349 |
| 2021 | 252 | 286 |
| 2022 | 231 | 257 |
| 2023 | 199 | 267 |
| 2024 | 182 | 263 |
| 2025 | 206 | 244 |
| 2026 | 124 | 144 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Semiconductor manufacturing device, wafer mounting device, dicing device, and semiconductor manufacturing method6 Oct 2026US 12,757,685 B2Mitsubishi Electric Corporation
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- Chip bonding system and chip bonding method25 Aug 2026US 12,721,104 B2Bondtech Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma diced wafers and methods thereof8 Oct 2026US 2026/0314321 A1UTAC Headquarters Pte. Ltd.
- Method for dicing semiconductor wafer and method for manufacturing semiconductor device1 Oct 2026US 2026/0305215 A1Resonac Corporation
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device1 Oct 2026US 2026/0305252 A1Resonac Corporation
Most cited
By later US patents
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992