Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device

A film-like adhesive agent composed of a resin composition having a thermosetting property and comprising a rubber component, the film-like adhesive agent having a first surface and a second surface, wherein:

• the film-like adhesive agent has a region in a vicinity of the first surface, in which a content of the rubber component increases from a side of the second surface toward a side of the first surface;
• and
• a graph obtained by indentation measurement using an atomic force microscope conducted has:
• a first portion in which an elastic modulus gradually increases starting from a measurement result at the first surface;
• and a second portion in which the elastic modulus is substantially constant from an end point of the first portion, and
• wherein the graph is obtained by:
• (1) curing the film-like adhesive agent, fixing the cured film-like adhesive agent on a sample stage of the atomic force microscope, and setting a cantilever in a cantilever holder;
• (2) pressing the cantilever to obtain a curve showing a relationship between an applied load and an indentation depth;
• and
• (3) obtaining the graph showing a relationship between an elastic modulus of the film-like adhesive agent and a distance from the first surface, from the curve, by using Hertz contact theory.