H10P 72/7404
The wafer tape being a laminate of three or more layers
Official title: {the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer}
H10P72/7404 (The wafer tape being a laminate of three or more layers) appears on 236 US grants and 354 published applications in this corpus.
Search patents in H10P- Granted patents
- 236
- Published applications
- 354
- Assignees
- 80
- Inventors
- 515
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 3 | 7 |
| 2003 | 5 | 9 |
| 2004 | 3 | 7 |
| 2005 | 4 | 13 |
| 2006 | 7 | 10 |
| 2007 | 6 | 7 |
| 2008 | 9 | 11 |
| 2009 | 6 | 5 |
| 2010 | 5 | 28 |
| 2011 | 8 | 15 |
| 2012 | 8 | 14 |
| 2013 | 8 | 20 |
| 2014 | 3 | 14 |
| 2015 | 9 | 15 |
| 2016 | 15 | 31 |
| 2017 | 17 | 20 |
| 2018 | 11 | 22 |
| 2019 | 13 | 18 |
| 2020 | 19 | 19 |
| 2021 | 9 | 14 |
| 2022 | 17 | 17 |
| 2023 | 7 | 11 |
| 2024 | 16 | 12 |
| 2025 | 12 | 3 |
| 2026 | 3 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Affixing device12 May 2026US 12,623,445 B2Mitsui Chemicals Ict Materia, Inc.
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications27 Jan 2026US 12,538,830 B2PulseForge Inc.
- Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications6 Jan 2026US 12,519,078 B2PulseForge Inc.
- Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device30 Dec 2025US 12,509,613 B2
- Dividing method of workpiece21 Oct 2025US 12,451,388 B2Disco Corporation
- Method for dicing semiconductor wafer and method for manufacturing semiconductor device1 Oct 2026US 2026/0305215 A1Resonac Corporation
- Film-like adhesive agent, adhesive film, dicing/die-bonding integrated film, and method for producing semiconductor device1 Oct 2026US 2026/0305252 A1Resonac Corporation
- Film adhesive, dicing/die attach film, semiconductor device, and production method for same24 Sep 2026US 2026/0293603 A1Resonac Corporation
- Method for manufacturing semiconductor device and adhesion film for semiconductor wafer processing27 Aug 2026US 2026/0255923 A1Resonac Corporation
- Adhesive film for semiconductor20 Aug 2026US 2026/0247921 A1Youlchon Chemical Co., Ltd.
Most cited
By later US patents
- Wafer machining adhesive tape, and its manufacturing method and using method162US 7,358,158 B2Mitsui Chemicals, Inc. · 2008
- Method of manufacturing semiconductor chip using laser light and plasma dicing159US 7,906,410 B2Panasonic Corporation · 2011
- Process for producing semiconductor device99US 5,882,956 ALintec Corporation · 1999
- Method of die bonding electronic component and die bonding apparatus thereof58US 6,176,966 B1Lintec Corporation · 2001
- Carrier tape56US 6,938,783 B2Amerasia International Technology, Inc. · 2005