Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device
OwnerMika Tanaka, Shogo Sobue +2inventors
InventorsMika Tanaka, Shogo Sobue, Shinji Irizawa, Saeko Ogawa
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Abstract
A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.
Claims20
A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate,
- the resin composition comprising a thermoplastic resin, a thermosetting resin, and an inorganic filler having an organic group located on a surface of the inorganic filler,
- wherein the organic group comprises a vinyl group or an epoxy group, and
- wherein an elastic modulus for a cured product of the resin composition is from 350 to 550 MPa at 25° C. after being heated for 30 minutes at 130° C. and for 2 hours at 170° C.
A heat-treated film comprising a resin composition for temporary fixing of a support for substrate conveyance to an organic substrate,
- wherein the resin composition comprises a thermoplastic resin, a thermosetting resin, and an inorganic filler having an organic group located on a surface of the inorganic filler,
- wherein the organic group comprises a vinyl group or an epoxy group, and
- wherein the heat-treated film has an elastic modulus of 350 to 550 MPa at 25° C.
Dependencies are inferred from the claim text.