H10P 72/7406
The wafer tape being a laminate of four or more layers
Official title: {the wafer tape being a laminate of four or more layers, e.g. including two or more additional layers beyond a base layer and an uppermost adhesive layer}
H10P72/7406 (The wafer tape being a laminate of four or more layers) appears on 5 US grants and 11 published applications in this corpus.
Search patents in H10P- Granted patents
- 5
- Published applications
- 11
- Assignees
- 9
- Inventors
- 31
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 5 |
| 2023 | 0 | 1 |
| 2024 | 1 | 2 |
| 2025 | 3 | 0 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic device30 Dec 2025US 12,509,613 B2
- Debonding tape and method of processing semiconductor wafer using the same29 Jul 2025US 12,374,575 B2Samsung Electronics Co., Ltd.
- Adhesive tape for semiconductor package manufacturing process, and method for manufacturing same11 Feb 2025US 12,221,569 B2Modu Tech Co., Ltd.
- Processing tape and method of fabricating a semiconductor device using the same16 Jul 2024US 12,040,213 B2Samsung Electronics Co., Ltd.
- Surface-protecting sheet and semiconductor wafer lapping method21 Oct 2008US 7,438,631 B2Lintec Corporation
- Method for manufacturing semiconductor device and adhesion film for semiconductor wafer processing27 Aug 2026US 2026/0255923 A1Resonac Corporation
- Adhesive film for semiconductor20 Aug 2026US 2026/0247921 A1Youlchon Chemical Co., Ltd.
- Processing tape and method of fabricating a semiconductor device using the same19 Sep 2024US 2024/0312826 A1Samsung Electronics Co., Ltd.
- Method and apparatus for a silicon die preparation including auxetic and electrostatic dissipatative features4 Jul 2024US 2024/0222182 A1Intel Corporation
- Protective film and back grinding method for semiconductor wafer21 Sep 2023US 2023/0298924 A1Mitsui Chemicals Tohcello, Inc.
Most cited
By later US patents