Adhesive tape for semiconductor package manufacturing process, and method for manufacturing same

An adhesive tape for a semiconductor package manufacturing process, which is configured to be attached to a semiconductor package bottom surface having a plurality of protruding electrodes formed thereon, the adhesive tape comprising:

• a first adhesive layer formed on a first base film;
• a second base film formed on the first adhesive layer, in which the second base film changes its shape to conform to a topology of the semiconductor package bottom surface when the adhesive tape is attached to the semiconductor package bottom surface, and the second base film contains a metal element so as to independently maintain the changed shape during the process;
• and
• a second adhesive layer formed on the second base film, the second adhesive layer having a smaller thickness than the first adhesive layer and having a lower adhesive strength than the first adhesive layer,
• wherein each of the first adhesive layer and the second adhesive layer has a spiral network molecular structure and comprises a first adhesive composition containing silicone, and
• wherein the adhesive tape further comprises:
• a first intermediate layer interposed between the first base film and the first adhesive layer;
• and
• a second intermediate layer interposed between the second base film and the second adhesive layer,
• wherein each of the first intermediate layer and the second intermediate layer has a spiral network molecular structure, comprises a second adhesive composition containing silicone, and has a basis weight ranging from 0.2 g/m2 to 0.5 g/m2.

An adhesive tape for a semiconductor package manufacturing process, which is configured to be attached to a semiconductor package bottom surface having a plurality of protruding electrodes formed thereon, the adhesive tape comprising:

• a first adhesive layer formed on a first base film;
• a second base film formed on the first adhesive layer, in which the second base film changes its shape to conform to a topology of the semiconductor package bottom surface when the adhesive tape is attached to the semiconductor package bottom surface, and the second base film contains a metal element so as to independently maintain the changed shape during the process;
• and
• a second adhesive layer formed on the second base film, the second adhesive layer having a smaller thickness than the first adhesive layer and having a lower adhesive strength than the first adhesive layer,
• wherein each of the first adhesive layer and the second adhesive layer has a spiral network molecular structure and comprises a first adhesive composition containing silicone, and
• wherein the first adhesive composition contains an adhesive base agent comprising a mixture of trimethylated silica, a dimethyl siloxane copolymer, and ethylbenzene.