Debonding tape and method of processing semiconductor wafer using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeonho Lee, Yeongseok Kim
Life of this patent
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Abstract
A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.
Claims20
A debonding tape comprising:
- a first base layer having a first modulus;
- a first adhesive layer on the first base layer;
- a second base layer on the first adhesive layer and having a second modulus greater than the first modulus;
- an intermediate layer on the second base layer;
- and
- a second adhesive layer on the intermediate layer.
A debonding tape comprising:
- a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter;
- and
- a second tape layer on the first tape layer and supporting the first tape layer,
- wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer,
- wherein the second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.
A method of processing a semiconductor wafer, the method comprising:
- preparing a debonding tape including a first tape layer having a first diameter and a second tape layer adhered on the first tape layer and having a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view, wherein the first tape layer includes a first base layer having a first modulus and a first adhesive layer on the first base layer, the second tape layer includes a second base layer having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer,
- wherein the debonding tape is mounted on a ring-shaped frame, and the circumferential portion of the first tape layer is supported by the ring-shaped frame and the second tape layer is in the ring-shaped frame;
- after turning over the ring-shaped frame, adhering a device wafer, to which a carrier wafer is adhered by a third adhesive layer, to the second adhesive layer of the debonding tape;
- debonding and separating the carrier wafer from the device wafer;
- reducing an adhesive force of the debonding tape by exposing the device wafer, to which the debonding tape is adhered, to UV rays;
- cutting a circumferential portion of the debonding tape, the circumferential portion surrounding the device wafer;
- turning over the device wafer, to which the cut debonding tape is adhered, and attaching the device wafer to a dicing tape;
- and
- debonding and separating the cut debonding tape from the device wafer attached to the dicing tape.
Dependencies are inferred from the claim text.