Process for producing semiconductor device
AssigneesTexas Instruments Japan Limited, Lintec Corporation
InventorsNorito Umehara, Masazumi Amagai, Mamoru Kobayashi, Kazuyoshi Ebe
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Abstract
A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.
Claims9
A process for producing a semiconductor device, which comprises the steps of:
- conducting a thermocompression bonding of a semiconductor wafer to a polyimide adhesive layer of a wafer dicing/bonding sheet including an expanding process sheet comprising a film and, formed thereon, an adhesive layer, and a polyimide bonding sheet attached to the expanding process sheet, the polyimide bonding sheet comprising a processing film and, formed thereon, a polyimide adhesive layer;
- dicing the semiconductor wafer into IC chips;
- expanding the wafer dicing/bonding sheet so as to enlarge IC chips spacings;
- peeling from the processing film the IC chips having the polyimide adhesive layer sticking thereto on their backs;
- and
- placing the IC chips on a lead frame in a manner such that the polyimide adhesive layer is interposed between the IC chips and the lead frame to thereby bond the IC chips to the lead frame.
A process for producing a semiconductor device, which comprises the steps of:
- conducting a thermocompression bonding of a semiconductor wafer to a polyimide adhesive layer of a polyimide bonding sheet, which polyimide bonding sheet comprises a processing film and, formed thereon, the polyimide adhesive layer;
- attaching an expanding process sheet comprising a film and, formed thereon, an adhesive layer to the polyimide bonding sheet in a manner such that the adhesive layer contacts an exposed surface of the processing film of the polyimide bonding sheet;
- dicing the semiconductor wafer into IC chips;
- expanding the expanding process sheet so as to enlarge IC chip spacings;
- peeling from the processing film the IC chips having the polyimide adhesive layer sticking thereto on their backs;
- and
- placing the IC chips on a lead frame in a manner such that the polyimide adhesive layer is interposed between the IC chips and the lead frame to thereby bond the IC chips to the lead frame.
Dependencies are inferred from the claim text.