Method of die bonding electronic component and die bonding apparatus thereof

A system for die bonding electronic components, comprising:

• a dicing tape which is comprised of at least one layer of shrink film and a pressure sensitive adhesive layer, wherein a multiplicity of diced chips is adhered to the dicing tape and arranged with predetermined spaces;
• a ring frame having the dicing tape adhered thereto, wherein said ring frame is disposed on a table which is equipped with heating means;
• and
• a suction collet disposed above said ring frame and movable in a vertical direction, whereby said multiplicity of diced chips is suctioned by the suction collet and separated one by one after said dicing tape is heated by said heating means,
• wherein said dicing tape is shrunk by said heating means so that an area of adhesion and adhesive strength between the multiplicity of diced chips and the adhesive layer is decreased.

An apparatus for die bonding electronic components, comprising:

• a dicing tape which is comprised of at least one layer of shrink film and a pressure sensitive adhesive layer, wherein a multiplicity of diced chips is adhered to said dicing tape and arranged with predetermined spaces;
• a ring frame having the dicing tape adhered thereto, wherein said ring frame is disposed on a table which is equipped with heating means;
• and
• a suction collet disposed above said ring frame and movable in a vertical direction, whereby said multiplicity of diced chips is suctioned by the suction collet and separated one by one after said dicing tape is heated by said heating means,
• wherein said heating means includes:
• a first heating means capable of heating only a peripheral region of the dicing tape where the multiplicity of chips is not adhered as a first stage in the step of shrinking the at least one layer of shrink film;
• and
• a second heating means capable of heating an inner region of the dicing tape where the multiplicity of diced chips is adhered as a second stage of the step.