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US 2026/0293603 A1Published application
Film adhesive, dicing/die attach film, semiconductor device, and production method for same
AssigneeResonac Corporation
InventorsXue ZHAO, Kohei TANIGUCHI, Yuta HARADA
Life of this patent
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Abstract
A film adhesive including metal particles, an epoxy resin, a phenolic resin, and an elastomer, in which a content of the metal particles is 80.0% by mass or more based on a mass of the film adhesive, the epoxy resin includes a first epoxy resin that is liquid at 25° C. and a second epoxy resin that is solid at 25° C., and when the content of the metal particles is 100 parts by mass, the content of the first epoxy resin is 4.0 to 5.5 parts by mass.
Claims12
A film adhesive comprising metal particles, an epoxy resin, a phenolic resin, and an elastomer, wherein
- a content of the metal particles is 80.0% by mass or more based on a mass of the film adhesive,
- the epoxy resin includes a first epoxy resin being liquid at 25° C. and a second epoxy resin being solid at 25° C., and
- a content of the first epoxy resin is 4.0 to 5.5 parts by mass when the content of the metal particles is 100 parts by mass.
Dependencies are inferred from the claim text.