Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
AssigneePulseForge Inc.
InventorsVahid Akhavan Attar, Vikram S. Turkani
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Abstract
A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.
Claims14
A method for debonding a wafer from a bonded wafer stack, said method comprising:
- placing a light-absorbing layer on a carrier, wherein said light-absorbing layer includes a metal alloy having approximately 90% tungsten and approximately 10% titanium;
- attaching a wafer to said light-absorbing layer of said carrier via an adhesive layer to form a bonded wafer stack;
- processing said wafer;
- applying a light pulse from a flashlamp to a non-wafer side of said carrier to heat said light-absorbing layer and said adhesive layer in order to loosen said wafer from said bonded wafer stack;
- and
- removing said wafer from said bonded wafer stack.
Dependencies are inferred from the claim text.