Wafer machining adhesive tape, and its manufacturing method and using method
AssigneeMitsui Chemicals, Inc.
InventorsShin Aihara, Hitoshi Koga
Life of this patent
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Abstract
An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G′ of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan δ as represented by the ratio of a loss modulus G″ to the storage modulus G′ is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.
Claims4
A method of using a wafer processing adhesive tape which comprises:
- adhering a wafer processing adhesive tape to a wafer under a load at a temperature of 20 to 80° C., said wafer processing adhesive tape comprising an adhesive layer on one side of a substrate layer wherein the storage modulus G′ of the adhesive layer at a temperature of 15 to 35° C. is 1 MPa or more and wherein the adhesive layer comprises at least one type of α-olefin copolymer comprising at least two α-olefins having 2 to 12 carbon atoms as a principal component;
- cutting the wafer into chips at a temperature of 15 to 35° C.;
- stretching said wafer processing tape at a temperature of 40 to 80° C.;
- and
- thereupon peeling the chips from said wafer processing adhesive tape at room temperature.
Dependencies are inferred from the claim text.