Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
AssigneePulseForge Inc.
InventorsVahid Akhavan Attar, Vikram S. Turkani
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Abstract
A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.
Claims16
A flashlamp debonding system for debonding a manufacturing assembly comprising an electronics structure, wherein the electronics structure is temporarily bonded to a remainder of the manufacturing assembly, the flashlamp debonding system comprising:
- a flashlamp configured to emit light pulses to illuminate the manufacturing assembly for debonding the electronics structure from the remainder of the manufacturing assembly;
- a flashlamp control subsystem for controlling the flashlamp, the flashlamp control subsystem comprising:
- a capacitive device;
- and
- an electronic switch device;
- and
- a debonding subsystem including:
- a support configured to support the manufacturing assembly;
- a feeder configured to feed the manufacturing assembly to the support for receiving illumination from the flashlamp;
- and
- a separator configured to separate the electronics structure from the remainder of the manufacturing assembly after the manufacturing assembly has received illumination from the flashlamp.
Dependencies are inferred from the claim text.