Method for dicing semiconductor wafer and method for manufacturing semiconductor device

Abstract

A method for dicing a semiconductor wafer includes a preparation step of preparing a stack in which an adhesive layer is disposed on a main surface of a semiconductor wafer and a back grind tape is disposed on the adhesive layer, a dicing tape disposing step of disposing a dicing tape on the back grind tape of the stack, and a dicing step of dicing the semiconductor wafer disposed on the back grind tape to singulate the semiconductor wafer into a plurality of semiconductor chips, wherein in the dicing step, the stack is cut from a semiconductor wafer side to a region between the adhesive layer and the dicing tape.

Dependencies are inferred from the claim text.