Chip bonding system and chip bonding method

A chip bonding system for bonding a chip to a substrate, comprising:

• a dicing device to, by dicing a dicing substrate stuck on a sheet, generate a plurality of chips that is stuck on the sheet with chips adjacent to each other in contact with each other or joined to each other at portions in a direction orthogonal to a thickness direction of the dicing substrate;
• an activation treatment device to activate bonding surfaces of respective ones of the plurality of chips that is stuck on the sheet with chips adjacent to each other in contact with each other or joined to each other at portions, to bond each of the plurality of chips to the substrate;
• and
• a chip bonding device to, after the bonding surfaces are activated by the activation treatment device, by bringing one chip picked out of the plurality of chips, the plurality of chips being stuck on the sheet while being separated from one another, into contact with the substrate, bond the one chip to the substrate,
• wherein the chip bonding device includes:
• a substrate holder to hold the substrate in such an attitude that a mounting surface of the substrate faces vertically downward;
• a head to support one chip among the plurality of chips in such an attitude that a bonding surface of the one chip faces vertically upward;
• and
• a relative position changer to, by bringing the head relatively close to the substrate holder, bond the one chip to the substrate.

A chip bonding method for bonding a chip to a substrate, the method comprising:

• a dicing step of, by dicing a dicing substrate stuck on a sheet, generating a plurality of chips that is arranged with chips adjacent to each other in contact with each other in a direction orthogonal to a thickness direction of the dicing substrate;
• an activation step of activating bonding surfaces of respective ones of the plurality of chips that is stuck on the sheet while being in contact with each other or joined to each other at portions, to bond each of the plurality of chips to the substrate;
• a stretching step of, by stretching the sheet on which the plurality of chips, the plurality of chips having the bonding surfaces activated in the activation step, is stuck, bringing the plurality of chips into a state of being separated from one another;
• and
• a bonding step of, by bringing one chip picked out of the plurality of chips into contact with the substrate, bonding the one chip to the substrate.