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US 12,745,601 B2Granted
Mount tape having an inner support layer between adhesive layers for semiconductor device assembly
AssigneeMicron Technology, Inc.
InventorsBrandon P. Wirz, Sui Chi Huang, Youngrae Kim
Life of this patent
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Abstract
Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.
Claims16
A mount tape assembly, comprising:
- an inner support layer between a first adhesive layer and a second adhesive layer;
- the first adhesive layer between the inner support layer and a support element;
- and
- the second adhesive layer between the inner support layer and a semiconductor wafer,
- wherein the mount tape assembly and the semiconductor wafer are configured to be diced simultaneously in a semiconductor device manufacturing process to form a singulated structure;
- wherein the singulated structure comprises a singulated semiconductor die, a singulated portion of the second adhesive layer, and a singulated portion of the inner support layer;
- wherein the first adhesive layer is configured for release at a first stage of the semiconductor device manufacturing process;
- wherein the first stage comprises a separation of the singulated structure from the support element based on the release of the first adhesive layer;
- wherein the singulated structure is configured for placement of the singulated semiconductor die on a semiconductor substrate;
- wherein the singulated portion of the second adhesive layer is configured for release at a second stage of the semiconductor device manufacturing process;
- and
- wherein the second stage comprises a separation of the singulated portion of the inner support layer from the singulated semiconductor die based on the release of the singulated portion of the second adhesive layer and after the placement of the singulated semiconductor die.
9 more elements
A mount tape configured for use in a semiconductor device manufacturing process, comprising:
- a first adhesive layer in contact with a first surface of a singulated portion of an inner support layer of the mount tape,
- wherein the first adhesive layer is configured to be released from the first surface of the singulated portion of the inner support layer upon exposure to a first environmental condition, and
- wherein the first adhesive layer is configured to separate a singulated semiconductor die from a support element based on release from the first surface of the singulated portion of the inner support layer;
- a singulated portion of a second adhesive layer in contact with a second surface of the singulated portion of the inner support layer of the mount tape,
- wherein the mount tape and a semiconductor wafer are configured to be diced simultaneously in the semiconductor device manufacturing process to form a singulated structure,
- wherein the singulated structure comprises the singulated semiconductor die, the singulated portion of the second adhesive layer, and the singulated portion of the inner support layer,
- wherein the second surface is opposite the first surface,
- wherein the singulated portion of the second adhesive layer is configured to adhere the second surface of the inner support layer to the singulated semiconductor die,
- wherein the singulated semiconductor die is configured for placement on a semiconductor substrate, and
- wherein the singulated portion of the second adhesive layer is configured to be released from the singulated semiconductor die upon exposure to a second environmental condition that is different from the first environmental condition;
- and
- the singulated portion of the inner support layer,
- wherein the singulated portion of the inner support layer is between the first adhesive layer and the second adhesive layer, and
- wherein the singulated portion of the inner support layer is configured to be removed from the singulated semiconductor die based on release of the singulated portion of the second adhesive layer from the singulated semiconductor die.
11 more elements
Dependencies are inferred from the claim text.