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US 9,461,018 B1Granted
Fan-out PoP structure with inconsecutive polymer layer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Nai-Wei Liu, Tsei-Chung Fu
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Abstract
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
Claims20
A method comprising:
- forming a polymer layer over a carrier;
- patterning the polymer layer to form a first opening;
- forming a through-via over the patterned polymer layer;
- placing a device die, with at least a portion of a die attach film attached to the device die being in the first opening;
- molding the device die and the through-via in a molding compound;
- forming redistribution lines electrically coupled to the device die and the through-via;
- removing the carrier from the polymer layer;
- and
- forming a second opening in the polymer layer to expose the through-via.
6 more elements
A method comprising:
- forming a dielectric layer over a base layer;
- removing a part of the dielectric layer to form a first opening, with a portion of the base layer exposed through the first opening;
- attaching a device die to the base layer through the first opening;
- encapsulating the device die in an encapsulating material;
- planarizing the encapsulating material and the device die, with metal features in the device die exposed;
- forming redistribution lines electrically coupling to the metal features in the device die;
- removing the base layer from the dielectric layer;
- forming a second opening in the dielectric layer;
- and
- forming a conductive feature extending into the second opening.
7 more elements
A method comprising:
- forming a polymer layer having a first opening therein;
- depositing a seed layer comprising:
- a first portion over the polymer layer;
- and
- a second portion in the first opening;
- applying and patterning a photo resist to form a second opening in the photo resist, with a portion of the seed layer exposed through the second opening;
- plating a metallic material into the second opening to form a metal post;
- removing the photo resist;
- removing portions of the seed layer not covered by the metallic material, wherein the second portion of the seed layer is removed;
- attaching a device die to a layer underlying the polymer layer through a die attach film, wherein the die attach film has at least a portion in the first opening;
- and
- dispensing a molding compound, with the device die molded in the molding compound, wherein the polymer layer contacts the molding compound.
9 more elements
Dependencies are inferred from the claim text.