Method for cleaning semiconductor chip, and method for manufacturing semiconductor device

A method for cleaning semiconductor chips, the method comprising:

• (a) cleaning, with a chemical solution, a plurality of semiconductor chips disposed in a region on a surface of an adhesive film, wherein the region is within a dicing ring attached on the surface;
• and
• (b) picking up the semiconductor chips from the surface after the cleaning, wherein the adhesive film comprises a base film and an adhesive layer formed on a surface of the base film,
• wherein the adhesive layer comprises an adhesive composition comprising a resin (A) represented by the following formula (1-1) and a photopolymerization initiator (B):
• wherein in formula (1-1), k, 1, m, and n represent a molar composition ratio when k+1+m+n=100, k is more than 0 and 92 or less, 1 is from 0 to 50, m is more than 0 and 90 or less, a total of k, 1, and m is from 65 to 95, n is from 5 to 35, R1, R2, R3, and R4 are a hydrogen atom or a methyl group, R5 is an alkyl group having 1 to 16 carbon atoms, R6 is an alicyclic hydrocarbon group having 3 to 30 carbon atoms or an aromatic hydrocarbon group having 6 to 20 carbon atoms, R7 is a hydrogen atom or —(CH2)j—COOH (wherein j is 1 or 2), and R8 is a group represented by the following formula (1-2) or the following formula (1-3):
• wherein in formula (1-2) and formula (1-3), p and q are an integer from 0 to 2, s is 0 when p is 0, and s is 1 when p is 1 or 2, and R9 is a hydrogen atom or a methyl group, and
• wherein the chemical solution is a chemical solution selected from the group consisting of solvent-based, acid-based, and alkali-based chemical solutions.