Package structure and method for forming the same

Abstract

A package structure is provided. The package structure includes a cell chip structure having a first substrate, a memory cell, and a multiplexer. The first substrate has a first front surface, and the memory cell and the multiplexer are formed at the first front surface. The package structure also includes an intermediate chip structure directly bonded to the cell chip structure and having a sense amplifier and a driver element. The intermediate chip structure does not have a memory cell, and the first front surface of the first substrate of the cell chip structure faces the intermediate chip structure.

Dependencies are inferred from the claim text.