H10P 72/7434
Used in a transfer process involving at least two transfer steps, i.e.
Official title: {used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate}
H10P72/7434 (Used in a transfer process involving at least two transfer steps, i.e.) appears on 1,399 US grants and 1,692 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,399
- Published applications
- 1,692
- Assignees
- 367
- Inventors
- 2,230
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 3 |
| 2002 | 9 | 15 |
| 2003 | 15 | 33 |
| 2004 | 25 | 45 |
| 2005 | 39 | 61 |
| 2006 | 35 | 42 |
| 2007 | 39 | 32 |
| 2008 | 24 | 35 |
| 2009 | 33 | 24 |
| 2010 | 28 | 26 |
| 2011 | 38 | 33 |
| 2012 | 31 | 42 |
| 2013 | 37 | 33 |
| 2014 | 32 | 37 |
| 2015 | 45 | 35 |
| 2016 | 47 | 58 |
| 2017 | 56 | 71 |
| 2018 | 60 | 92 |
| 2019 | 87 | 96 |
| 2020 | 86 | 107 |
| 2021 | 94 | 165 |
| 2022 | 113 | 155 |
| 2023 | 114 | 157 |
| 2024 | 111 | 141 |
| 2025 | 104 | 104 |
| 2026 | 54 | 50 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display apparatus and electronic device25 Aug 2026US 12,720,915 B2Semiconductor Energy Laboratory Co.Ltd.
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Thermally conductive semiconductor packaging structure and method for preparing same25 Aug 2026US 12,721,161 B2SJ Semiconductor(Jiangyin) Corporation
- Semiconductor device, package structure and method of fabricating the same11 Aug 2026US 12,708,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Redistribution structure with copper bumps on planar metal interconnects and methods of forming the same4 Aug 2026US 12,702,078 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laminate, method for manufacturing laminate, and method for manufacturing semiconductor device24 Sep 2026US 2026/0293604 A1Toray Industries, Inc.
- Temporary Chip Assembly, Display Panel, and Manufacturing Methods of Temporary Chip Assembly and Display Panel20 Aug 2026US 2026/0247771 A1Chongqing Konka Photoelectric Technology Research Institute Co., Ltd.
- Method for cleaning semiconductor chip and method for manufacturing semiconductor device20 Aug 2026US 2026/0247896 A1
- Signal-heat separated tmv packaging structure and manufacturing method thereof13 Aug 2026US 2026/0240015 A1Zhuhai ACCESS Semiconductor Co., Ltd.
- Chip structure and method of fabricating the same6 Aug 2026US 2026/0231791 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Three-dimensional chip stacking assembly678US 6,355,501 B1International Business Machines Corporation · 2002
- Stretchable form of single crystal silicon for high performance electronics on rubber substrates525US 7,521,292 B2The Board of Trustees of the University of Illinois · 2009
- Method of making a three-dimensional integrated circuit501US 5,563,084 AFraunhofer-Gesellschaft zur F orderung der angewandten Forschung e.V. · 1996