Temporary Chip Assembly, Display Panel, and Manufacturing Methods of Temporary Chip Assembly and Display Panel

A temporary chip assembly, comprising:

• a temporary substrate;
• a pyrolytic adhesive layer formed by pyrolytic adhesive, wherein the pyrolytic adhesive layer is arranged on a front surface of the temporary substrate;
• and
• a plurality of micro light-emitting chips arranged on the pyrolytic adhesive layer;
• wherein the pyrolytic adhesive layer comprises a plurality of mutually separated pyrolytic adhesive units which are in one-to-one correspondence with the plurality of micro light-emitting chips;
• electrodes of each of the plurality of micro light-emitting chips are respectively embedded into the corresponding pyrolytic adhesive unit, and after the pyrolytic adhesive unit is heated, pyrolytic adhesive located between the electrodes of the micro light-emitting chip adheres to the micro light-emitting chip and is separated from the temporary substrate along with the micro light-emitting chip;
• and a de-bonding temperature value of the pyrolytic adhesive is greater than or equal to a melting point value of bonding pads bonded with the electrodes.