Laminate, method for manufacturing laminate, and method for manufacturing semiconductor device

A method for producing a laminate, successively comprising:

• a step (I) of using a laminate 1, in which a laser-absorbing temporary adhesive layer 1, a protective layer 1, and a semiconductor layer 1 are laminated in this order on a laser-transmitting substrate 1, and a laminate 2, in which a pressure-sensitive adhesive layer is laminated on a support substrate 2, to cause a surface of the laminate 1 on a semiconductor layer 1 side and a surface of the laminate 2 on a pressure-sensitive adhesive layer side to face each other;
• and
• a step (II) of irradiating the laser-absorbing temporary adhesive layer 1 with a laser from a surface side of the laminate 1 opposite to the surface thereof on the semiconductor layer 1 side while transmitting the laser through the laser-transmitting substrate 1, and transferring a structure 1 in which the protective layer 1 and the semiconductor layer 1 are laminated to the laminate 2 to form a laminate 3 in which the pressure-sensitive adhesive layer, the semiconductor layer 1, and the protective layer 1 are laminated in this order on the support substrate 2.

A laminate comprising:

• a support substrate 2, a pressure-sensitive adhesive layer, a semiconductor layer 1, and a protective layer 1 laminated in this order, wherein
• the pressure-sensitive adhesive layer has a patterned shape.