Thermally conductive semiconductor packaging structure and method for preparing same

A method for preparing a thermally conductive semiconductor packaging structure, comprising:

• providing a wafer, which comprises multiple sub-regions, wherein the wafer comprises a front side and a back side, wherein pads are provided on the front sides of the sub-regions;
• patterning the back sides of the sub-regions to form grooves, wherein the grooves include various shapes;
• filling the grooves with a thermally conductive material to form thermally conductive members;
• cleaning the backsides to expose the thermally conductive members;
• cutting the wafer along borders of the sub-regions to obtain thermally conductive dies;
• forming a die packaging structure by packaging one or more of the thermally conductive dies together, wherein each of the thermally conductive dies comprises a first surface and a second surface opposite to the first surface, with the first surface exposing the thermally conductive members, wherein the second surface is provided with an electrically interconnecting component which is electrically connected to the pads;
• providing a substrate, and electrically connecting the electrical interconnecting component to the substrate;
• and
• forming a heat dissipating cover over the substrate, wherein the heat dissipating cover is in contact with the thermally conductive members.