H10P 72/744
Details of chemical or physical process used for separating the auxiliary support
Official title: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
H10P72/744 (Details of chemical or physical process used for separating the auxiliary support) appears on 2,904 US grants and 3,819 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,904
- Published applications
- 3,819
- Assignees
- 649
- Inventors
- 4,831
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 3 |
| 2002 | 3 | 11 |
| 2003 | 9 | 18 |
| 2004 | 8 | 14 |
| 2005 | 10 | 20 |
| 2006 | 11 | 21 |
| 2007 | 12 | 22 |
| 2008 | 12 | 26 |
| 2009 | 12 | 24 |
| 2010 | 27 | 40 |
| 2011 | 27 | 67 |
| 2012 | 35 | 120 |
| 2013 | 70 | 154 |
| 2014 | 102 | 187 |
| 2015 | 167 | 209 |
| 2016 | 223 | 315 |
| 2017 | 261 | 284 |
| 2018 | 265 | 273 |
| 2019 | 289 | 265 |
| 2020 | 260 | 342 |
| 2021 | 231 | 265 |
| 2022 | 229 | 242 |
| 2023 | 171 | 237 |
| 2024 | 173 | 220 |
| 2025 | 180 | 202 |
| 2026 | 102 | 238 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Method of manufacturing laminated assembly29 Sep 2026US 12,751,251 B2Disco Corporation
- Method of manufacturing laminate and kit of adhesive compositions1 Sep 2026US 12,723,176 B2Nissan Chemical Corporation
- Electronic component manufacturing method, manufacturing film, and manufacturing tool25 Aug 2026US 12,721,109 B2Mitsui Chemicals Ict Materia, Inc.
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
- Device and method for manufacturing display panel, and method of manufacturing electronic device including display panel1 Oct 2026US 2026/0305228 A1Samsung Display Co., Ltd.
- Adjustable chuck for wafer bonding1 Oct 2026US 2026/0305258 A1Tokyo Electron Limited
- Package structure with integrated chips1 Oct 2026US 2026/0305488 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Separation apparatus, separation system, and separation method24 Sep 2026US 2026/0293578 A1Tokyo Electron Limited
Most cited
By later US patents
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Multi-stack package-on-package structures744US 9,735,131 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Fan-out PoP structure with inconsecutive polymer layer720US 9,461,018 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016