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US 2026/0305258 A1Published application
Adjustable chuck for wafer bonding
AssigneeTokyo Electron Limited
InventorsAdam GILDEA, Christopher NETZBAND
Life of this patent
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Abstract
Conformal semiconductor chucks are disclosed. The semiconductor chucks can include an inner portion comprising a first material, and having an opening to receive a striker. The semiconductor chucks can include an outer portion comprising a vacuum pad, wherein the outer portion is configured to move vertically, relative to the inner portion while coupled with a semiconductor wafer.
Claims20
A method, comprising:
- engaging a wafer holder configured to selectively couple with a first wafer to couple the first wafer with a wafer chuck having a lateral surface, the wafer chuck comprising a first portion and a movable second portion that is displaceable in a vertical direction perpendicular to the lateral surface;
- instantiating, with the wafer holder engaged, wafer bonding between the first wafer and a second wafer;
- and
- maintaining the engagement of the wafer holder while a propagation wave of the wafer bonding reaches the wafer holder to cause a vertical displacement of the second portion of the wafer chuck, relative to the first portion.
1 more element
A system for fabricating semiconductor devices, comprising:
- a first portion of a semiconductor chuck comprising a first material along a facing thereof;
- and
- a second portion of the semiconductor chuck circumscribed about the first portion along the facing, the second portion comprising a second material configured to exhibit greater compliance to vertical deflection than the first material, wherein the second portion comprises wafer holder disposed along the facing, the wafer holder configured to selectively couple with a semiconductor wafer along the facing.
A wafer chuck comprising:
- an inner portion comprising a first material, and having an opening to receive a striker;
- and
- an outer portion comprising a vacuum pad, wherein the outer portion is configured to move vertically, relative to the inner portion while coupled with a semiconductor wafer.
Dependencies are inferred from the claim text.